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10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD Features
Ultra Wide Band Driver Amplifier Self Biased Architecture 17.0 dB Small Signal Gain 5.0 dB Noise Figure 100% On-Wafer RF, DC and Output Power Testing 100% Visual Inspection to MIL-STD-883 Method 2010
Chip Device Layout
XD1004-BD
General Description
Mimix Broadband's 10.0-40.0 GHz GaAs MMIC distributed amplifier has a small signal gain of 17.0 dB with a noise figure of 5.0 dB. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for microwave, millimeter-wave, wideband military, and fiber optic applications.
Absolute Maximum Ratings
Supply Voltage (Vd) Supply Current (Id) Input Power (Pin) Storage Temperature (Tstg) Operating Temperature (Ta) Channel Temperature (Tch)
+6.0 VDC 175 mA +17 dBm -65 to +165 OC 2 -55 to MTTF Table 2 MTTF Table
(2) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Frequency Range (f ) Input Return Loss (S11) Output Return Loss (S22) Small Signal Gain (S21) Gain Flatness ( S21) Reverse Isolation (S12) Noise Figure (NF) Output Power for 1 dB Compression Point (P1dB)1 Drain Bias Voltage (Vd) Supply Current (Id) (Vd=5.0V)
(1) Measured using constant current.
Units GHz dB dB dB dB dB dB dBm VDC mA
Min. 10.0 -
Typ. 7.0 12.0 17.0 +/-2.5 30.0 5.0 TBD +5.0 115
Max. 40.0 +5.5 145
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD Distributed Amplifier Measurements
XD1004-BD Vd=See Legend, Id=See Legend
22 20 18 16
Gain (dB)
XD1004-BD Vd=See Legend, Id=See Legend
0 -10 -20 -30 -40 -50 -60 -70 -80
14 12 10 8 6 4 2 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Vd=3.0V, Id=100 mA Vd=4.0V, Id=120 mA Vd=5.0V, Id=115 mA
Reverse Isolation (dB)
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Vd=3.0V, Id=100 mA Vd=4.0V, Id=120 mA Vd=5.0V, Id=115 mA
XD1004-BD Vd=See Legend, Id=See Legend
0 -5 -10 -15 -20 -25 -30 -35 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Vd=3.0V, Id=100 mA Vd=4.0V, Id=120 mA Vd=5.0V, Id=115 mA
Output Return Loss (dB)
0 -5 -10 -15 -20 -25 -30 -35 -40
XD1004-BD Vd=See Legend, Id=See Legend
Input Return Loss (dB)
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 Frequency (GHz) Vd=3.0V, Id=100 mA Vd=4.0V, Id=120 mA Vd=5.0V, Id=115 mA
XD1004-BD Vd=5.0, Id=115 mA
10
10
XD1004-BD Vd=See Legend, Id=See Legend
9 8
9 8 7
Noise Figure (dB)
Noise Figure (dB)
7 6 5 4 3 2
6 5 4 3 2
1
1 0 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz)
0 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Frequency (GHz) Vd=3.0V, Id=100 mA Vd=4.0V, Id=120 mA Vd=5.0V, Id=115 mA
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD S-Parameters
Typcial S-Parameter Data for XD1004-BD Vd=5.0 V Id=115 mA Frequency (GHz) 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 25.0 26.0 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0 41.0 42.0 43.0 44.0 45.0 46.0 47.0 48.0 S11 (Mag) 0.266 0.327 0.377 0.424 0.433 0.412 0.409 0.408 0.425 0.443 0.429 0.393 0.351 0.302 0.223 0.109 0.082 0.177 0.308 0.414 0.488 0.545 0.563 0.551 0.514 0.473 0.430 0.371 0.324 0.268 0.156 0.111 0.478 0.733 0.784 0.807 0.819 0.818 0.814 0.786 0.760 S11 (Ang) -84.45 -91.33 -101.79 -115.11 -126.57 -135.70 -139.41 -144.24 -148.34 -158.58 -168.79 -178.03 174.97 165.61 159.38 167.48 -136.03 -104.33 -108.68 -122.58 -134.12 -149.53 -160.84 -170.23 -179.06 175.85 171.06 163.46 159.72 149.53 127.96 -1.01 -67.43 -116.92 -134.69 -147.18 -158.53 -165.72 -173.65 175.95 165.30 S21 (Mag) 2.817 3.905 5.149 6.898 8.344 9.429 10.013 9.785 9.206 8.446 7.880 7.447 7.231 7.260 7.405 7.721 7.961 8.048 8.049 7.843 7.618 7.229 6.955 6.762 6.558 6.405 6.263 6.137 6.172 6.316 6.684 6.681 6.830 4.453 2.919 1.993 1.406 1.022 0.808 0.657 0.665 S21 (Ang) 79.53 52.25 25.97 -6.89 -34.99 -64.24 -92.80 -120.19 -143.62 -169.45 172.65 156.62 141.98 126.80 111.79 91.59 73.39 54.71 35.90 16.71 -2.03 -24.45 -41.89 -59.40 -76.39 -93.81 -111.51 -134.09 -152.84 -172.87 163.95 134.93 98.74 49.92 24.62 4.19 -13.99 -29.20 -42.51 -60.82 -75.14 S12 (Mag) 0.0028 0.0029 0.0041 0.0054 0.0052 0.0036 0.0040 0.0027 0.0002 0.0024 0.0017 0.0019 0.0016 0.0029 0.0053 0.0082 0.0129 0.0169 0.0204 0.0216 0.0250 0.0282 0.0289 0.0302 0.0314 0.0327 0.0332 0.0336 0.0297 0.0267 0.0194 0.0087 0.0160 0.0280 0.0329 0.0385 0.0396 0.0364 0.0368 0.0399 0.0353 S12 (Ang) -71.28 -91.04 -105.02 -143.98 -164.64 167.86 162.52 128.36 108.13 -117.53 -170.59 131.67 -20.62 -73.56 -69.71 -83.98 -96.11 -112.12 -129.34 -137.60 -148.72 -160.89 -170.71 -176.93 175.02 168.19 159.36 145.03 132.80 118.95 98.26 27.65 -109.83 -154.33 -165.52 -178.14 163.90 161.74 160.26 150.91 138.11 S22 (Mag) 0.329 0.270 0.255 0.287 0.332 0.374 0.415 0.406 0.392 0.362 0.317 0.275 0.242 0.212 0.176 0.141 0.114 0.095 0.109 0.128 0.141 0.156 0.155 0.141 0.118 0.092 0.073 0.064 0.064 0.090 0.146 0.263 0.405 0.449 0.450 0.454 0.437 0.419 0.430 0.455 0.451 S22 (Ang) 75.78 55.13 34.10 3.96 -21.03 -46.40 -71.95 -94.54 -112.14 -132.18 -145.22 -156.40 -163.29 -171.23 -174.25 -174.45 -172.92 -163.22 -145.40 -147.14 -150.12 -159.55 -170.40 179.45 170.74 165.96 160.02 158.77 152.46 132.61 98.18 58.18 14.95 -29.19 -49.46 -64.80 -76.65 -83.59 -83.85 -95.96 -98.88
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD Mechanical Drawing
1.250 (0.049)
XD1004-BD
1.070 (0.042)
1
2
1.102 (0.043)
0.0 0.0
3
1.000 0.820 (0.039) (0.032)
(Note: Engineering designator is 22DSBA0423)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 0.775 mg. Bond Pad #1 (RF In) Bond Pad #2 (RF Out) Bond Pad #3 (Vd)
Bias Arrangement
XD1004-BD
RF In
1
2
RF Out
Bypass Capacitors - See App Note [2]
3
Vd
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD
App Note [1] Biasing - As shown in the bonding diagram, this device operates using a self-biased architecture and only requires one drain bias. Bias is nominally Vd=5V, Id=115 mA. App Note [2] Bias Arrangement - Each DC pad (Vd) needs to have DC bypass capacitance (~100-200 pF) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended.
MTTF Graphs
1.00E+09
These numbers were calculated based on accelerated life test information and thermal model analysis received from the fabricating foundry.
XD1004-BD Vd=5.0 V Id=115 mA
1.00E+04
XD1004-BD Vd=5.0 V Id=115 mA
1.00E+08
1.00E+03
MTTF (hours)
1.00E+07
FITS
1.00E+02
1.00E+06
1.00E+01
1.00E+05 55 65 75 85 95 105 115 125 Backplate Temperature (deg C)
1.00E+00 55 65 75 85 95 105 115 125 Backplate Temperature (deg C)
XD1004-BD Vd=5.0 V Id=115 mA
114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 55 65 75 85 95 105 115 125 Backplate Temperature (deg C) 200 190 180 170
XD1004-BD Vd=5.0 V Id=115 mA
Rth (deg C/W)
Tch (deg C)
160 150 140 130 120 110 100 55 65 75 85 95 105 115 125 Backplate Temperature (deg C)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.
10.0-40.0 GHz GaAs MMIC Distributed Amplifier
December 2006 - Rev 19-Dec-06
D1004-BD Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not ingest. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. he gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering
XD1004-BD-000V XD1004-BD-EV1
Description
RoHS compliant die packed in vacuum release gel packs XD1004-BD evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 6
Characteristic Data and Specifications are subject to change without notice. (c)2006 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws.

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